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TAC Mission Computers

A family of small-form-factor edge computers designed for military and aerospace platforms

Mighty. Light.
A family of rugged mission computers dominating SWaP-C and achieving cutting-edge performance across the modern cyber battlespace with the latest in embedded computing technology

LIGHT, DURABLE, READY FOR EXTREMES
Less than 5 pounds, fanless, sealed, and operating between -40...+70°C at 100% stress.

MADE IN THE USA
Proudly designed, manufactured, assembled, tested, and supported in Atlanta, Georgia.

FULL CONTROL & CONFIGURABILITY
Easily remove storage drives and change out the real-time clock’s field-replaceable battery.

Key Features Overview
  • Intel® Next-Gen processors
  • Multiple sealed storage drives
  • Secure operation with Trusted Platform Module (TPM 2.0)
  • Optional internal cards: 1553, GPS, Video
  • Supports NVIDIA graphics on MXM module
  • Designed to meet IP67, MIL-STD-810, MIL-STD-901, DO-160, EMI/EMC, CE
Technical Specifications
  • COM Express Type 7
  • Intel® Next-Gen processors
  • Up to 48GB Dual Channel DDR4 ECC or Non-ECC

    INPUT / OUTPUT (2x 38999 connectors: AMPHENOL TV07WCI-21-35P)
  • USB: 4x USB 2.0 ports
  • Video: 2x DVI ports (optional HD-SDI)
  • LAN: 3x Gigabit Ethernet ports
  • Serial: 2x RS232 serial ports
  • SATA: 2x 6Gb/s SATA connectors
  • NVMe: 2x NVMe connectors
  • TPM 2.0: Infineon SLB9670

    SWaP
  • Size:
    • Height: 2.75” (6.985 cm)
    • Width: 5.875” (14.9225 cm)
    • Depth without flanges: 7” (17.78 cm)
    • Depth with flanges: 7.75” (19.685 cm)
  • Weight: less than 5 lbs.
  • Power: 28VDC power source

    STORAGE
  • Take advantage of improved data security and ease of access with the advanced physical protections of fully sealed removable storage drives.

    FANLESS SYSTEM COOLING
  • The TAC’s passive-cooling design is perfect for debris-heavy environments and noiseless operation.

    GRAPHICS
  • Designed to support the latest NVIDIA GPUs on a MXM module

    SYSTEM BIOS
  • BIOS Type: SPI NOR Flash with Insyde BIOS
  • BIOS Features:
    - Plug and Play (PnP)
    - APM 1.2
    - PCI 2.2
    - ACPI 1.0 / 2.0
    - USB keyboard support
    - SMBIOS 2.3
    - UEFI

    ENVIRONMENTAL SPECIFICATIONS
  • Operating Temperature: -40°C - +70°C
  • Storage Temperature: -51°C - +85°C
  • Shock: 3 axis, 35g, 25ms
  • Vibration: 4.76Grms, 10Hz to 2000 Hz (SSD)

    COMPLIANCE
  • Designed to meet the following standards/certifications:
    - IP67
    - MIL-STD-810H,
    - MIL-STD-901H
    - DO-160F
    - 2014/35/EU (LVD)
    - 2014/30/EU (EMC)
    - CE

The above specifications are configuration dependent.
1. Extended temperature range is dependent on system configuration, components, and application thermal profile. Pls. contact systerra computer for information specific to your desired configuration requirements.
2. Trenton designs all products to meet or exceed listed data sheet specifications. Some specifications are configuration dependent.
Bitte fordern Sie ein individuelles Angebot an - wir beraten Sie gerne / Please call or mail for configuration options - we will gladly advise you
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