The SV2-MOVIE is a peripheral slot board for PICMG® CompactPCI® Serial systems and acts as carrier for an MXM 3.0/3.1 graphics module. The SV2-MOVIE is provided with four DisplayPort front panel connectors and can accommodate either a type A (82x70mm2) or type B MXM graphics module (82x105mm2).
MXM (Mobile PCI Express Module) is an interconnect standard for GPUs created by MXM-SIG. MXM cards are mostly equipped with an AMD or Nvidia GPU core. With respect to a reasonable thermal management, a low power GPU is recommended for industrial applications together with the SV2-MOVIE.
For best performance, the SV2-MOVIE should be operated in a CompactPCI® Serial fat pipe slot, which provides a PCI Express® x8 host interface. The SV2-MOVIE is equipped with a PCIe Gen3 redriver for optimum signal integrity.
For use with suitable MXM graphics modules, low profile passive heat spreaders are available, for either 4HP or 8HP front panel width. In addition, the CompactPCI® Serial rack must provide suitable forced airflow (e.g. by fans).
MXM Host I/F
- Carrier board for type A or type B MXM 3.0/3.1 graphics module
- Maximum module dimensions 105mm x 82mm x 7mm (type B)
- Maximum module dimensions 113mm x 82mm x 7mm (w/o front panel connectors)
- MXM 3.0 edge card connector 314/281 Pins
- PCI Express® Gen3 (8GT/s) redriver on-board, PCIe x8
- Custom cooler plate design (4HP/8HP envelope)
- CUDA (Compute Unified Device Architecture) capable with Nvidia MXM GPU
- Option +12V external power connector 4.20mm for MXM modules >60W
- Option +12V power connector 3.5mm Eurostyle for attachment of a 12V DC fan
- Heat spreader available for CoolConduct® heat exchanger systems (option)
Sample MXM Modules
- Aetina M3N1060-MN (NVIDIA GTX 1060 Pascal)
- Aetina M3N1070-MN (NVIDIA GTX 1070 Pascal, for CUDA operation only, no front I/O DisplayPort connectors available due to extended module dimensions)
- Maximum module dimensions 113mm x 82mm x 7mm (w/o front panel connectors)
- NVIDIA® QUADRO® P3000 (1280 CUDA cores, 3.9TFLOPS)
- NVIDIA® QUADRO® P5000 (2048 CUDA cores, 6.4TFLOPS)
Environment, Regulatory
- Designed & manufactured in Germany
- Certified quality management according to ISO 9001
- Long term availability
- Rugged solution (coating, sealing, available on request)
- RoHS compliant
- Commercial and industrial temperature range
- Humidity 5%...95% RH non condensing
- Altitude -300m...+3000m
- Shock 15g 0.33ms, 6g 6ms
- Vibration 1g 5-2000Hz
- MTBF 45.1 years
- EC Regulations EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)
Ordering Options
| Manuf. Part No. | | Product Description |
| SV2-1510-MOVIE | | 3U/4HP Carrier for MXM 3.0 Type B graphics module, 4 x DisplayPort front panel connectors, installed AMD E8860 graphic module, DDR5 2GB 128bit 640 Shader Units, 37W, with heatsink |
| SV2-1600-MOVIE | | 3U/8HP Carrier for MXM 3.0 Type B graphics module, 4 x DisplayPort front panel connectors, installed Nvidia GTX 1060 MXM 3.1 type B module, GDDR5 6GB 192bit 1280 CUDA Cores, optimized heat sink occ. 2 slots |
| SV2-1610-MOVIE | | 3U/4HP Carrier for MXM 3.0 Type B graphics module, 4 x DisplayPort front panel connectors, installed Nvidia GTX 1060 MXM 3.1 type B module, GDDR5 6GB 192bit 1280 CUDA Cores, |
| SV2-1611-MOVIE | | 3U/4HP Carrier for MXM 3.0 Type B graphics module, 4 x DisplayPort front panel connectors, installed Nvidia GTX 1060 MXM 3.1 type B module, GDDR5 6GB 192bit 1280 CUDA Cores, ext. temp. range -40...+75°C |
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