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RES-XR6-2U-HD

Modular high-density rugged 2HE Enterprise Server for Cluster Computing

The Themis RES-XR6-2U High Density (HD) system is suited for mission-critical, high-performance cluster computing environments where server Size, Weight, and Power (SWAP) is severely limited. With its 4 slots for CPU and storage modules it offers compared to normal density servers double computing density while reducing system weight by ~50%.

Available in a 2U (four bay) front I/O or a 2U rear I/O chassis, Themis RES-HD servers integrate the latest Intel® Xeon® Scalable processors and provide maximum versatility with over six configurable “plug and pull” compute, storage, networking, expansion, or management modules. Modules can be mixed and matched – with each combination creating a new type of functionality.

Each chassis has a typical 15-year lifespan, eliminating the need to rip and replace during technology upgrades and streamlining deployment. With lightweight modules, RES HD simplifies logistics, cuts costs associated with spares, and enables modules to be repurposed across different applications.

Modular Scalability with over six “plug and pull” modules
The newest generation XR6 RES HD modules integrate the latest Intel Xeon Scalable processors to deliver superior workload-optimized performance and hardware-enhanced security in a smaller footprint. Each module is designed for a special purpose—compute, storage, networking, expansion, or management. Modules can be mixed and matched – with each combination creating a new type of functionality. Current modules include:
  • Compute (HDC): Dual-socket processor module, (HDC-U.2): Dual-socket processor module with U.2

  • Storage (HDS): Dual-socket processor module with 4 (HDS4), 8 (HDS8) or 8 with rulers (HDS8R) storage drives.

  • Storage Expansion (HDSE): Storage expansion module (currently available in rear I/O chassis configurations)

  • PCIe Expansion (HDP): Dual-socket processor module with multiple PCIe options. Accelerate virtual desktops and achieve higher throughput for compute intensive workloads with the latest NVIDIA Quadro or Tesla graphics card. Each configured HDP module can integrate one GPGPU.

  • Networking (HDN) switches: 1Gbps (HDN1) and 100Gbps (HDN100) managed switches

Designed for mission critical applications outside the data center, all modules meet or exceed military specifications—incorporating advanced thermal and mechanical design features to provide enhanced reliability with superior resiliency to shock, vibration, and temperature extremes.

RES-XR6-HDC Compute Module Specifications

  • Processor: Two Intel® Xeon® Scalable with 22 cores, 44 threads (Typical customer specifications. Specifications are configuration dependent. Up to 20 cores per processor for 0...+50°C thermal profiles.)
  • Memory: Up to 1TB DDR4 ECC 2666MHz, 16 DIMM
  • Disk On Module: Two with up to 128GB per DOM
  • Two USB 3.0 ports
  • VGA port
  • Network Support: four RJ45 Ethernet ports, multiple options (see attached Datasheet)
  • One serial port
  • Up to two PCIe 3.0 x16 Expansion Slot
  • Windows®, Linux®, VMWARE® and other hypervisors
  • IPMI v2.0, Redfish option available
  • Weight: 4,76kg
  • Expansion: up to 2 PCIe 3.0x16 low profile, half length cards

RES-XR6-HDC-U.2 Compute Module Specifications

  • Processor: Two Intel® Xeon® Scalable with 22 cores, 44 threads (Typical customer specifications. Specifications are configuration dependent. Up to 20 cores per processor for 0...+50°C thermal profiles.)
  • Memory: Up to 1TB DDR4 ECC 2666MHz, 16 DIMM
  • Disk On Module: Two with up to 128GB per DOM
  • Two USB 3.0 ports
  • VGA port
  • Network Support: four RJ45 Ethernet ports, multiple options (see attached Datasheet)
  • One serial port
  • Up to two PCIe 3.0 x16 Expansion Slot
  • Windows®, Linux®, VMWARE® and other hypervisors
  • IPMI v2.0, Redfish option available
  • Weight: 4,76kg
  • 2 NVMe U.2 drives for up to 64TB of storage
  • Expansion: up to 1 PCIe 3.0x16, low profile, half length card (in lieu of U.2 SSD)
  • Expansion/Storage Combined
    - Storage: 1 NVMe U.2 drive for up to 32TB of storage
    - Expansion: Up to 1 PCIe 3.0x16 low profile, half length card

RES-XR6-HDS4 Storage Module Specifications

  • Processor: Two Intel® Xeon® Scalable with 22 cores, 44 threads (Typical customer specifications. Specifications are configuration dependent. Up to 20 cores per processor for 0...+50°C thermal profiles.)
  • Memory: Up to 1TB DDR4 ECC 2666MHz, 16 DIMM
  • Disk On Module: Two with up to 128GB per DOM
  • Two USB 3.0 ports
  • VGA port
  • Network Support: four RJ45 Ethernet ports, multiple options e.g. 100 Gbps (QSFP28), 56 Gbps (QSFP), 25 Gbps (SFP28), 10 GBaseT, 1GBaseT
  • One serial port
  • Storage: 4 front-access SATA, SAS3 or U.2 storage drives for up to 120TB of storage
  • Expansion: low/high profile, half length cards
    - Front I/O Expansion: up to 2 PCIe 3.0 x16 + 1 PCIe 3.0 x8
    - Rear I/O Expansion: 2 PCIe 3.0 x16 + 1 PCIe 3.0 x8 or 1 PCIe 3.0 x16 + 3 PCIe 3.0 x8
  • Windows®, Linux®, VMWARE® and other hypervisors
  • IPMI v2.0, Redfish option available
  • Weight: 6,80kg with drives

RES-XR6-HDS8 Storage Module Specifications

  • Processor: Two Intel® Xeon® Scalable with 22 cores, 44 threads (Typical customer specifications. Specifications are configuration dependent. Up to 20 cores per processor for 0...+50°C thermal profiles.)
  • Memory: Up to 1TB DDR4 ECC 2666MHz, 16 DIMM
  • Disk On Module: Two with up to 128GB per DOM
  • Two USB 3.0 ports
  • VGA port
  • Network Support: four RJ45 Ethernet ports, multiple options e.g. 100 Gbps (QSFP28), 56 Gbps (QSFP), 25 Gbps (SFP28), 10 GBaseT, 1GBaseT
  • One serial port
  • Storage: 8 SATA or SAS3 drives for up to 240TB of storage
  • Expansion: low/high profile, half length cards
    - Front I/O Expansion: up to 2 PCIe 3.0 x16
    - Rear I/O Expansion: 1 PCIe 3.0 x16 + 2 PCIe 3.0 x8
  • Windows®, Linux®, VMWARE® and other hypervisors
  • IPMI v2.0, Redfish option available
  • Weight: 8,16kg with drives

RES-XR6-HDS8R High Density Storage with Rulers

  • Processor: Two Intel® Xeon® Scalable with 22 cores, 44 threads (Typical customer specifications. Specifications are configuration dependent. Up to 20 cores per processor for 0...+50°C thermal profiles.)
  • Memory: Up to 1TB DDR4 ECC 2666MHz, 16 DIMM
  • Disk On Module: Two with up to 128GB per DOM
  • Two USB 3.0 ports
  • VGA port
  • Network Support: four RJ45 Ethernet ports, multiple options e.g. 100 Gbps (QSFP28), 56 Gbps (QSFP), 25 Gbps (SFP28), 10 GBaseT, 1GBaseT
  • One serial port
  • Storage: 8 EDSFF E1.L drives for up to 256TB of storage
  • Expansion: up to 2 PCIe 3.0x16, low profile, half length cards
    - Front I/O Expansion: up to 2 PCIe 3.0 x16
    - Rear I/O Expansion: up to 2 PCIe 3.0x16 low profile
  • Windows®, Linux®, VMWARE® and other hypervisors
  • IPMI v2.0, Redfish option available
  • Weight: 8,16kg with drives

RES-XR6-HDSE High Density Storage Expansion Specifications

  • Storage: 8 SATA or SAS3 drives for up to 240TB of storage
  • Requirements: special rear I/O configurations
  • Weight: 3,63kg with drives

RES-XR6-HDP High Density PCIe Expansion

  • Processor: Two Intel® Xeon® Scalable with 22 cores, 44 threads (Typical customer specifications. Specifications are configuration dependent. Up to 20 cores per processor for 0...+50°C thermal profiles.)
  • Memory: Up to 1TB DDR4 ECC 2666MHz, 16 DIMM
  • Disk On Module: Two with up to 128GB per DOM
  • Two USB 3.0 ports
  • VGA port
  • Network Support: four RJ45 Ethernet ports, multiple options e.g. 100 Gbps (QSFP28), 56 Gbps (QSFP), 25 Gbps (SFP28), 10 GBaseT, 1GBaseT
  • One serial port
  • Expansion: Up to 5 PCiE Cards
    1. 1 double wide PCiE 3.0 x16 (eg. TESLA GPGPU), 2 PCIe 3.0 x16, low profile, half length cards
    2. 1 PCIe 3.0 x 8, 1 PCIe 3.0, low profile, half length cards
    3. 2 PCIe 3.0 x16 low profile, half length cards and 2 PCIe 3.0 x8 full height, full length cards
  • Windows®, Linux®, VMWARE® and other hypervisors
  • IPMI v2.0, Redfish option available
  • Weight: 5,67kg, 6,80kg with TESLA card

RES-XR6-HDN1 1GbE High Density Networking Switch

  • Ethernet Ports (RJ45): 16 x 1GbE
  • Other Ports (RJ45): 2 (serial, ethernet management)
  • Network: Layer 2/3
  • Routing: IPv4/IPv6 - IP multicast, VLANs, IETF, IEEE, DSL Forum
  • Quality of Service: QoS IEEE 802.1 priority tagging, DSCP, traffic queues
  • Management: Ethernet (http, telnet, SNMP, and RS232 (CLI)
  • 48Gbps performance switching capacity
  • 35.71 Mpps maximum forwarding rate
  • 8K entries MAC address table size, 3.5Mbits Packet Buffer
  • Forwarding mode: store and forward
  • Supports half/full duplex operation at 10/100Mbps
  • Supports port auto-negotiation

RES-XR6-HDN100 100GbE High Density Networking Switch

  • Switch: Integrated Mellanox SN2010
  • Ethernet Ports: 18 SFP+/SFP28 10/25GbE + 4 splittable QSFP+/QSFP28 40/100GbE ports
  • Other Ports (RJ45): 2 (serial, ethernet management)
  • Throughput: Non-blocking bidirectional, 1,7 Tb/s
  • Latency: 300ns for 100GbE, consistent latency
  • Network Layer 2/3 Features:
    10/25/40/50/56/100GbE, Multi chassis LAG (MLAG)
    802.1W rapid spanning tree, 802.1Q, multiple STP
    802.3 ad Link Aggregation (LAG) & LACP
    Jumbo frames (9216 Bytes)
    IPv4 & IPv6 route maps including BGP4, OSPFv2
    BFD (BGP, OSPF, static routes), DHCPv4/v6 Relay
    Router port, int VLAN, NULL interface for routing
  • Network Virtualization: VXLAN Hardware VTEP-L2 GW. Integration with VMware NSX, Openstack and more
  • Software Defined Storage (SDN): Openflow 1.3 (hybrid, supported controllers)
  • Security:
    - US APL Department of Defense Certification
    - System secure mode: FIPS 140-2 Compliance
    - Access Control Lists (ACLs L2-L4 & user defined)
    - 802.1X Port based access control
    - SSH server restrict mode - NIST 800-181A
    - CoPP (IP filter), port isolation, storm control

System Environmentals
PARAMETER NON-OPERATING If different: OPERATING OPERATING EXTENDED
Temperature range -40...+70°C 0...+50°C -15...+60°C
Humidity (non-condensing) 5% to 95% 8% to 95%
Shock 3 axis, 35G, 25ms
Vibration 4.76 Grms, 5 Hz to 2000 Hz
Safety EN60950
RFI/EMI EN 55032, EN 55024, EN 61000
Compliance MIL-STD 810G


Bitte beachten Sie, dass die hier und in der Produktdokumentation aufgeführten Beschreibungen keine Zusicherung von technischen Daten darstellen. Die Spezifikationen können jederzeit und ohne Ankündigung geändert werden. In Abhängigkeit von Konfiguration und Betriebsbedingungen stehen Funktionen und Ausstattungsmerkmale zum Teil nicht gleichzeitig zur Verfügung. Die Gewichtsangaben der Module und Systeme beziehen sich auf typische Ausbauvarianten und können entsprechend abweichen. Für die verbindliche Spezifikation von Ausstattungen und technischen Eigenschaften fordern Sie bitte daher immer ein schriftliches Angebot an.
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