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RES-XR5-3U-HD

EOL - Modular high-density rugged 3HE Enterprise Server for Cluster Computing
Product phased out. Please call systerra for replacement options.

The Themis RES-XR5-3U High Density (HD) system is suited for mission-critical, high-performance cluster computing environments where server Size, Weight, and Power (SWAP) is severely limited. With its 6 slots for CPU and storage modules it offers compared to a stack of 1U servers double computing density while reducing system weight by ~50%.

Three Types of HD Modules enables System Configuration Flexibility
Combining the robust thermal and kinetic management technology of the RES-XR5 rack mountable server family, Intel® Xeon® E5-2600 V3 and V4 Series processors, and Supermicro X9DRT-IBFF motherboards, the RES-XR5-HD system features a rugged 20-inch deep chassis that can house combinations of three separate, hot-pluggable HD compute modules:

  • RES-XR5-HDC High Density Compute Module (occupies one of six chassis slots with two processor sockets, eight DIMM, and up to three high-bandwidth I/O slots)
  • RES-XR5-HDS High Density Storage Module (occupies two of six chassis slots with two processor sockets, eight DIMM, up to three high-bandwidth I/O slots, and four 3.5 inch disk slots)*
  • RES-XR5-HDFS High Density Flash Storage Module (occupies two of six chassis slots with two processor sockets, eight DIMM, up to three high-bandwidth I/O slots, and four PCIe slots)*

    *Each RES-XR5-HDS and RES-XR5-HDFS module includes a companion high-density compute module. RES-XR5-HDS and RES-XR5-HDFS modules occupy two of six chassis slots. The RES-XR5-HD System offers six configuration options.

RES-XR5-HDC Compute Module Specifications
The RES-XR5-HDC processor module occupies a single chassis slot with two processor sockets, eight DDR4 ECC DIMMs (8, 16, 32, or 64 GB), and up to three high-bandwidth I/O ports. Intel E5-2600 V3 and V4 processors enable 50% increase in computing density with Themis RES family of servers. Computing density can be measured by cores/volume or cores/kg. E5-2600 V3 and V4 processors are socket compatible with the complete RES family of servers.
  • One or two Intel Xeon E5-2600V3/V4 Series CPUs with up to 18 Cores
  • Eight slots for 8...64 GB DDR4 ECC memory modules (max. 512 GB)
  • Network Support: 56 Gb/s Infiniband, 40 Gb/s Ethernet (QSFP), 10 Gb/s Ethernet (RJ45/SFP+)
  • Interface Copper or fiber
  • IPMI Remote Management (KVM-over-IP)
  • Boot Options PXE or DOM
  • One PCIe 3.0 x16 Expansion Slot

RES-XR5-HDS Storage Module Specifications
The RES-XR5-HDS module occupies two chassis slots with two processor sockets, eight DDR4 ECC DIMMs (8, 16, 32, or 64 GB), up to three high-bandwidth I/O ports, and four 3.5 inch disk slots. The RES-XR5-HDS module includes a companion RES-XR5-HDC processor module.
  • One or two Intel Xeon E5-2600V3/V4 Series CPUs with up to 18 Cores
  • Eight slots for 8...64 GB DDR4 ECC memory modules (max. 512 GB)
  • Network Support: 56 Gb/s Infiniband, 40 Gb/s Ethernet (QSFP), 10 Gb/s Ethernet (RJ45/SFP+)
  • Interface Copper or fiber
  • IPMI Remote Management (KVM-over-IP)
  • Boot Options PXE or storage canister
  • Expansion Slot One PCIe 3.0 x16
  • SATA Drives Four 3.5 inch SATA drives in a single
  • Removable storage canister

RES-XR5-HDFS Flash Storage Module Specifications
The RES-XR5-HDFS module occupies two of four chassis slots with two processor sockets, eight DDR4 ECC DIMMs (8, 16, 32, or 64 GB), up to three high-bandwidth I/O ports, and four PCIe slots. The RES-XR5-HDFS module includes a companion RES-XR5-HDC processor module.
  • One or two Intel Xeon E5-2600V3/V4 Series CPUs with up to 18 Cores
  • Eight slots for 8...64 GB DDR4 ECC memory modules (max. 512 GB)
  • Network Support: 56 Gb/s Infiniband, 40 Gb/s Ethernet (QSFP), 10 Gb/s Ethernet (RJ45/SFP+)
  • Interface Copper or fiber
  • IPMI Remote Management (KVM-over-IP)
  • Boot Options PXE or storage canister boot MSATA
  • Expansion Slot One PCIe 3.0 x16
  • PCIe SSD Four PCIe SSDs , 256 GB MSATA SSD

RES-XR5-HDS8 Flash Storage Module Specifications
The RES-XR5-HDS8 Storage module occupies two chassis slots with two processor sockets, eight DIMMs (8, 16, 32, or 64 GB), up to three high-bandwidth I/O ports, one RAID controller, and eight 2.5 inch SAS/SATA HDD/SDD disk slots for up to 16 TB of storage with integrated RAID/Storage Controller and mSATA Boot Drive. The RES-XR5-HDS8 Storage module includes a companion RES-XR5-HDC processor module with two E5-2600 v3 Series Intel Xeon processors with up to sixteen cores per socket.
  • One or two Intel Xeon E5-2600V3/V4 Series CPUs with up to 18 Cores
  • Eight slots for 8...64 GB DDR4 ECC memory modules (max. 512 GB)
  • Network Support: 56 Gb/s Infiniband, 40 Gb/s Ethernet (QSFP), 10 Gb/s Ethernet (RJ45/SFP+)
  • Interface Copper or fiber
  • IPMI Remote Management (KVM-over-IP)
  • Boot Options PXE or storage canister boot MSATA
  • Expansion Slot One PCIe 3.0 x16
  • Eight 2.5 inch SAS/SATA drives (HDD or SSD) in a single removable storage canister

RES-XR5-HD Switch-Module
The RES-SWITCH module occupies one chassis slot with a 12-port, managed 56 Gb/s Infiniband VPI SDN/40GBe switch system that delivers up to 1.3Tb/s of non-blocking bandwidth and 200ns port-to-port latency. The Switch module enables data centers to scale out with Fourteen Data Rate (FDR) Infiniband. Mellanox switching technology provides industry-leading performance, power, and density. The HD hosted switch also interoperates with existing networks, supports Software Defined Networks (SDN), and provides fabric management for cluster and converged I/O applications.Additionally, with a break out cable, each QSFP port can support four ports of 10GbE for a total of 48 10GbE ports.

RES-XR5-HD System Management Module
The RES-TRM module provides remote independent initialization, administration, and monitoring of the health and environment of one or more modules or servers and related computing infrastructure equipment, including fault data history, analytics and prognostics. The Resource Manager provides a single user interface for easy access to managed systems’ service processors, displaying information obtained from these processors in a converged dashboard view. Themis’ i7 based Resource Manager leverages open standards such as Open Stack Dashboard (Horizon) and Zabbix, a highly efficient, enterprise-class open source distributed monitoring solution for networks and applications.

Functionality:
  • Number of ports: fourteen ports
  • Performance switching capacity: 48 Gbps
  • Maximum forwarding rate: 35.71 Mpps
  • MAC address table size: 8K entries
  • Packet buffer: 3.5 Mbits
  • Forwarding mode: store and forward
  • IEEE 802.3 compliant
  • IEEE 802.3u compliant
  • IEEE 802.3ab compliant
  • Supports half/full-duplex operation at 10/100Mbps
  • Supports full-duplex operation at 1000Mbps
  • Supports auto-negotiation for each port
  • Auto MDI/MDIX
  • IEEE 802.3x flow control support
  • IEEE 802.3az compliant

Industry Leading I/O Bandwidth
RES-XR5-HD modules support up to three 56 Gb/sec Infiniband (IB) or 40 Gb Ethernet ports to provide industry leading I/O bandwidth. Each RES-XR4 HD module is available with a single high bandwidth I/O port. A FDR option supports 56 Gb/sec IB or 40 Gb/sec Ethernet via a QSFP connector. Alternatively a QDR option supports 40 Gb/sec IB or 10 Gb/sec Ethernet. Each module also has a PCIe expansion slot that supports two additional FDR or QDR ports.

Configuration Examples:
  • Six HDC Modules
    (12 processor sockets, 18 high-bandwidth I/O slots)
  • Two HDS Modules + Two HDC Modules, Two HDC Modules
    (eigth processor sockets, 12 high-bandwidth I/O slots, and eight 3.5 inch disk slots)
  • Two HDFS Modules + Two HDC Modules, Two HDC Modules
    (eigth processor sockets, 12 high-bandwidth I/O slots, and eight PCIe 3.0 slots)
  • Two HDC Modules, One HDS Module, Two HDC Modules
    (10 processor sockets, 15 high-bandwidth I/O slots, and four 3.5 inch disk slots)
  • Two HDC Modules, One HDFS Module, Two HDC Modules
    (10 processor sockets, 15 high-bandwidth I/O slots, and four PCIe 3.0 slots)
  • One HDS Module, One HDFS Module, Two HDC Modules
    (eigth processor sockets, 12 high-bandwidth I/O slots, four 3.5 inch disk slots, and four PCIe 3.0 slots)

System Environmentals
PARAMETER NON-OPERATING OPERATING
Temperature range -40...+70°C 0...+ 50°C
Humidity (non-condensing) 5% to 95% 8% to 90%
Shock 3 axis, 30G, 25ms 3 axis, 30G, 25ms
Vibration 2.0 Grms, 8 Hz to 2000 Hz 2.0 Grms, 8 Hz to 2000 Hz
Safety EN60000 EN60000
RFI/EMI EN55022/24 EN55022/24
Compliance CE Mark CE Mark


Bitte beachten Sie, dass die hier und in der Produktdokumentation aufgeführten Beschreibungen keine Zusicherung von technischen Daten darstellen. Die Spezifikationen können jederzeit und ohne Ankündigung geändert werden. In Abhängigkeit von Konfiguration und Betriebsbedingungen stehen Funktionen und Ausstattungsmerkmale zum Teil nicht gleichzeitig zur Verfügung. Für die verbindliche Spezifikation von Ausstattungen und technischen Eigenschaften fordern Sie bitte daher immer ein schriftliches Angebot an.
Ordering Options
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