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RES-XR4-2U-HD

EOL - Modular high-density rugged 2HE Enterprise Server for Cluster Computing
Product phased out. Please call systerra for replacement options.

The Themis RES-XR4 High Density (HD) system is suited for mission-critical, high-performance cluster computing environments where server Size, Weight, and Power (SWAP) is severely limited. With its 4 slots for CPU and storage modules it offers compared to a stack of 1U servers double computing density while reducing system weight by ~50%.

Three Types of HD Modules enables System Configuration Flexibility
Combining the robust thermal and kinetic management technology of the RES-XR4 rack mountable server family, Intel® Xeon® E5-2660 Series processors, and Supermicro X9DRT-IBFF motherboards, the RES-XR4 HD system features a rugged 20-inch deep chassis that can house combinations of three separate, hot-pluggable HD compute modules:

  • RES-XR4-HDC High Density Compute Module (occupies one of four chassis slots with two processor sockets, eight DIMM, and up to three high-bandwidth I/O slots)
  • RES-XR4-HDS High Density Storage Module (occupies two of four chassis slots with two processor sockets, eight DIMM, up to three high-bandwidth I/O slots, and four 3.5 inch disk slots)*
  • RES-XR4-HDFS High Density Flash Storage Module (occupies two of four chassis slots with two processor sockets, eight DIMM, up to three high-bandwidth I/O slots, and four PCIe slots)*

    *Each RES-XR4-HDS and RES-XR4-HDFS module includes a companion high-density compute module. RES-XR4-HDS and RES-XR4-HDFS modules occupy two of four chassis slots. The RES-XR4 HD System offers six configuration options.

RES-XR4-HDC Compute Module Specifications
  • One or two 4-, 6, or 8-core 2.2 GHz Intel Xeon E5-2660 Series CPUs
  • Eight slots for 4...16 GB memory modules (max. 128 GB)
  • Ethernet Support: Gigabit Ethernet, QDR, or FDR
  • Interface Copper or fiber
  • IPMI Remote Management (KVM-over-IP)
  • Boot Options PXE or DOM
  • One PCIe 3.0 x16 Expansion Slot

RES-XR4-HDS Storage Module Specifications
  • One or two 4-, 6, or 8-core 2.2 GHz Intel Xeon E5-2660 Series CPUs
  • Eight slots for 4...16 GB memory modules (max. 128 GB)
  • Ethernet Support: Gigabit Ethernet, QDR, or FDR
  • Interface Copper or fiber
  • IPMI Remote Management (KVM-over-IP)
  • Boot Options PXE or storage canister
  • Expansion Slot One PCIe 3.0 x16
  • SATA Drives Four 3.5 inch SATA drives in a single
  • Removable storage canister

RES-XR4-HDFS Flash Storage Module Specifications
  • One or two 4-, 6, or 8-core 2.2 GHz Intel Xeon E5-2660 Series CPUs
  • Eight slots for 4...16 GB memory modules (max. 128 GB)
  • Ethernet Support: Gigabit Ethernet, QDR, or FDR
  • Interface Copper or fiber
  • IPMI Remote Management (KVM-over-IP)
  • Boot Options PXE or storage canister boot MSATA
  • Expansion Slot One PCIe 3.0 x16
  • PCIe SSD Four PCIe SSDs , 256 GB MSATA SSD

Industry Leading I/O Bandwidth
RES-XR4 HD modules support up to three 56 Gb/sec Infiniband (IB) or 40 Gb Ethernet ports to provide industry leading I/O bandwidth. Each RES-XR4 HD module is available with a single high bandwidth I/O port. A FDR option supports 56 Gb/sec IB or 40 Gb/sec Ethernet via a QSFP connector. Alternatively a QDR option supports 40 Gb/sec IB or 10 Gb/sec Ethernet. Each module also has a PCIe expansion slot that supports two additional FDR or QDR ports.

Configuration Options
  • Four HDC Modules
    (eight processor sockets, twelve high-bandwidth I/O slots)
  • Two HDS Modules
    (four processor sockets, six high-bandwidth I/O slots, and eight 3.5 inch disk slots)
  • Two HDFS Modules
    (four processor sockets, six high-bandwidth I/O slots, and eight PCIe 3.0 slots)
  • Two HDC Modules, One HDS Module
    (six processor sockets, nine high-bandwidth I/O slots, and four 3.5 inch disk slots)
  • Two HDC Modules, One HDFS Module
    (six processor sockets, nine high-bandwidth I/O slots, and four PCIe 3.0 slots)
  • One HDS Module, One HDFS Module
    (four processor sockets, six high-bandwidth I/O slots, four 3.5 inch disk slots, and four PCIe 3.0 slots)

System Environmentals
PARAMETER NON-OPERATING OPERATING
Temperature range -40...+70°C 0...+ 50°C
Humidity (non-condensing) 5% to 95% 8% to 90%
Shock 3 axis, 30G, 25ms 3 axis, 30G, 25ms
Vibration 2.0 Grms, 8 Hz to 2000 Hz 2.0 Grms, 8 Hz to 2000 Hz
Safety EN60000 EN60000
RFI/EMI EN55022/24 EN55022/24
Compliance CE Mark CE Mark

The above specifications are configuration dependent.
Bitte beachten Sie, dass die hier und in der Produktdokumentation aufgeführten Beschreibungen keine Zusicherung von technischen Daten darstellen. Die Spezifikationen können jederzeit und ohne Ankündigung geändert werden. In Abhängigkeit von Konfiguration und Betriebsbedingungen stehen Funktionen und Ausstattungsmerkmale zum Teil nicht gleichzeitig zur Verfügung. Für die verbindliche Spezifikation von Ausstattungen und technischen Eigenschaften fordern Sie bitte ein schriftliches Angebot an.
Ordering Options

Nicht für neue Projekte empfohlen, bitte wenden Sie sich an systerra computer, wir helfen gerne - not recommended for new design, please contact systerra, we will gladly advise you
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