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IDAN-SPM6030HR

Stackable Packaging System for PC/104-Plus SPM6030 DSP Module

Rugged Stackable Packaging System for the TMS320C6202 based PC/104-Plus Industrial DSP module by RTD Embedded Technologies.

Features
  • PC/104-Plus stackable bus structure
  • Modular rugged milled aluminum frames
  • Maintains the PC/104 bus self-stacking concept
  • Allows quick interchangeability of modules
  • Frame includes SPM6030HR video module, wiring and connectors
  • Aluminum Alloy - 6061, Temper-T6
  • Finish - MIL-PRF-85285 polyurethane topcoat, per FED-STD-595, color 36495 (light gray). Panel engravings per FED-STD-595, color 37038 (black).
    • Additional paint options available upon request
External I/O Ports
  • Three 9-pin male D-Sub connectors
    3 Multi-channel Buffered Serial Ports (McBSP):
    - Buffered Asynchronous Memory Interface of the DSP
    - High-speed data transfer device between the DSP and the analog interface
    - TI/EI, MVIP, SCSA, ST bus, AC97 SPI Compatible
  • 15-pin male D-Sub connector
    JTAG emulator connector, Boundary-Scan-Compatible
  • 9-pin female D-Sub connector
    SyncBus for Synchronous operation of RTD's DAQ boards
    - +5, ±12 VDC power supply and grounds
Physical Attributes
  • Dimensions
    • Length: 5.983 inches (152 mm)
    • Width: 5.117 inches (130 mm)
    • Height: 0.669 inches (17 mm)
  • Weight: Approximately 0.80 lbs. (0.36 Kg)
  • Standard Operating Temperature
    • 90% humidity non-condensing: -40...+85°C
  • Storage Temperature: -55...+125°C
Ordering Options
Manuf. Part No  Part Description
IDAN-SPM6030HR-233-16S  233 MHz DSP Module with 16MB SDRAM in modular IDAN frame
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