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IDAN-DM6430HR

Stackable Packaging System for DM6430 DAQ Module

Stackable Packaging System for DM6430 DAQ Module.Operating Temperature -40...+85°C

Features
  • PC/104 stackable bus structure
  • Modular rugged milled aluminum frames
  • Maintains the PC/104 bus self-stacking concept
  • Allows quick interchangeability of modules
  • Frame includes DM6430HR data module, wiring and connectors
  • Aluminum Alloy - 6061, Temper-T6
  • Finish - MIL-PRF-85285 polyurethane topcoat, per FED-STD-595, color 36495 (light gray). Panel engravings per FED-STD-595, color 37038 (black).
    • Additional paint options available upon request
External I/O Ports
  • 62-pin or 68-pin high density connectors
    - 8 Differential or 16 Single Ended Channels
    - 2 fast analog outputs
    - 8 bit-programmable digital I/O lines and an 8-bit programmable port
    - Timers and Counters
    - +5, ±12 VDC power supply and grounds
Physical Attributes
  • Dimensions
    • Length: 5.983 inches (152 mm)
    • Width: 5.117 inches (130 mm)
    • Height: 0.669 inches (17 mm)
  • Weight: Approximately 1.38 lbs. (0.62 Kg)
  • Standard Operating Temperature
    • 90% humidity non-condensing: -40...+85°C
  • Storage Temperature: -55...+125°C
  • Power requirements: 3.5 W @ 5 VDC typical
Ordering Options
Manuf. Part No    Part Description
IDAN-DM6430HR-62S  62-pin, 16-bit, 100 kHz DAQ with 1K FIFO buffer in modular IDAN frame
IDAN-DM6430HR-68S  68-pin, 16-bit, 100 kHz DAQ with 1K FIFO buffer in modular IDAN frame
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