IDAN-BRG2110

Stackable Packaging System for BRG2110 PCI Express to PCI Bridge Modules

Stackable Packaging System for BRG2110 Bridge Modules.

Features

PCI Express Expansion Bus
PCI Expansion Bus
Modular rugged milled aluminum frames
Maintains the PC/104 bus self-stacking concept
Allows quick interchangeability of modules
Each frame includes BRG2110 bridge module, wiring and connectors
Aluminum Alloy - 6061, Temper-T6
Finish - MIL-PRF-85285 polyurethane topcoat, per FED-STD-595, color 36495 (light gray). Panel engravings per FED-STD-595, color 37038 (black).
- Additional paint options available upon request
Physical Attributes
Dimensions:
- Length: 5.983 inches (152 mm)
- Width: 5.117 inches (130 mm)
- Height: 0.669 inches (17 mm)
Weight: Approximately 0.46 lbs. (0.21 Kg)
Operating Temperature: -40 to +85°C, 90% humidity non-condensing
Storage Temperature: -55 to +125°C
Board-Level Specifications
BRG2110AHR & BRG2110BHR

Ordering Options

Manuf. Part No		Part Description
IDAN-BRG2110AHRS		PCIe to PCI Bridge for Above the CPU in modular IDAN frame
IDAN-BRG2110BHRS		PCIe to PCI Bridge for Below the CPU in modular IDAN frame

+49 611 44889 400

info@systerra.de

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