RTD has raised the performance bar again with the latest enclosure technology for the PC/104 Architecture. The HiDANplus™ has an added Signal Raceway to allow customer defined Power, Analog, and Digital signals to be passed internally between modules with the convenience of the self-contained IDAN® modules. Customers can define how many PC/104 boards are in each module along with customer defined I/O connectors allowed in each module section.
HiDANplus™ is latest in Industrial PC computing power and control capability in a sealed modular housing. The HiDANplus™ system is a machined aluminum modular enclosure acting as a heatsink that envelopes your sensitive data acquisition system and delivers performance from –40 to +85°C without a fan. An EMI environmental gasket is integrated into a RTD proprietary technology, tongue and groove configuration around the perimeter of each section offering 80dB of isolation to 1 GHz and rated at withstanding 30 PSID.
Military style circular connectors offer easy connection while maintaining the environmental seal integrity built into this enclosure. The small footprint, 178mm x 158mm x 185mm, allows this unit to fit anywhere. Maximum computing performance is achieved using a Intel® 1.4 GHz Pentium® M running at 1.4 GHz, up to 1024 MB DDR SDRAM, and an OnBoard Flash DiskChip with up to 4 GB of storage.
I/O includes USB 2.0, Fast Ethernet, AC97 Audio support, software selectable RS-232/422/485, SVGA with resolution up to 2048 x 1536 pixels with 32K colors, and multiPort with Floppy/Parallel & Advanced Digital I/O (aDIO). An EIDE hard drive controller supports an optional internal hard drive module gives you Gigabytes of storage with connectors for an external floppy drive and CD-Rom drive.
Extensive data acquisition and control capability is achieved with a variety of analog inputs, analog outputs & digital I/O modules. Communication between two HiDANplus™ systems or your main network is accomplished using a standard Serial, Ethernet, CAN Bus or Wireless connection.
Power requirements are less than 20-Watts and are handled using an internal 83-Watt Power Supply module with an 8-32 VDC input. Other configurations available allow for power supply isolation with up to 70 VDC input
Features
- Watertight design
- Maintains the PC/104 self-stacking concept
- 100-pin Signal Raceway allows passage of signals and data between frames internally
- Internal RF isolation available
- Maintains seal integrity with EMI O-ring
- MIL-C38999 Series I connectors
- Aluminum Alloy 6061 Chemical Composition Limits (%) - Silicon 0.4-0.8, Iron 0.7, Copper 0.15-0.4, Magnesium 0.8-1.2, Chromium 0.04-0.35, Zinc 0.25, Titanium 0.15, and Aluminum comprises the remainder.
- Extremely versatile, this heat-treatable alloy combines good weldability and formability, high corrosion resistance, and medium strength. Use it for chemical equipment, vehicle parts, scaffolding, and pipe fittings. Yield strength is 40 ksi (40,000 psi). Hardness is 95 Brinell. Melting range is 582° to 652°C.
- Thermal treatment - Annealed - Temper - T6 = Solution heat treated and artificially aged.
- Finish - Class 3, Clear Chromate per MIL-C-5541
- Operating System Support: DOS™, Windows™, Windows CE™, QNX, Linux™, VXWorks, RTCX, OS/9, and Phar-Lap
Please contact our technical support staff to custom design your own environmentally sealed HiDAN System
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