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The concept of a Computer on Module, or COM, is not new within the embedded computer industry. Various COM solutions and implementations have been around for years, but none ever took hold as a dominant or de facto standard within the embedded computer industry.
The key advantage of COMs in typical embedded designs is that the most rapidly changing part of the design, is modularized and decoupled from the rest of the system design.
Taking advantage of a fragmented embedded market and technological disruptions within the PC industry, the PICMG COM Express specification defines a standard COM form factor that brings modularity and standardization to embedded COM designs in the future.
Das Computer on Module Konzept (kurz COM) ist nicht neu für die Embedded Computer Industrie. In den vergangenen Jahrzehnten gab es zahllose COM Lösungen, von denen aber keine signifikante Marktanteile erreichte oder sich als Standard durchsetzen konnte.
Der Hauptvorteil des COM Konzepts in einem typischen embedded Design ist die Möglichkeit die Kernkomponente mit Prozessor, Speicher, I/Os, die der schnellsten technischen Veränderung unterworfen ist vom restlichen Systems zu entkoppeln und so auf der Performance Seite von der technischen Entwicklung zu partizipieren.
Der durch die PICMG genormte COM Express Standard bietet gegenüber den, im Embedded Markt verbreiteten, proprietären Lösungen einen zukunftssicheren Standard für modulare Designs.
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Auswahl COM Express
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Module im Mini COM Express Format (84 x 55 mm)
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PowerPC Architecture based COM Express Modules
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X86 Architecture based COM Express Modules for Harsh Environments
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X86 Architecture based COM Express Modules for Industrial Environments
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Standard, Industrial, and MIL Spec. Com Express Carrier Boards
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Rugged COM Express System Lösungen auf Basis von COTS Modulen
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Broschüren, Whitepapers und Spezifikationen zu COM Express
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Module im Mini COM Express Format
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Abaco
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mini COM Express Module Based on NVIDIA® Tegra® K1 GPU processing technology
Abaco’s mCOM10-K1 COM Express module is the miniature form-factor solution in our COM Express portfolio, and offers the high level performance and ultimate durability needed for applications that operate in harsh environments... more
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COM Express Modules with PowerPC Prozessor
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GE Automation
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Rugged COM Express® Module based on Freescale PowerPC QorlQ P1
The bCOM6-P1100 module is well-suited for OEMs designing real-time embedded computing platforms into equipment for industrial or harsh environments. This durable COM Express solution delivers high performance coupled with low power consumption, reduced overall design cycle and lower validation costs... more
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Rugged COM Express Modules
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Rugged COM Express - Computer-On-Modules
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| Rugged COM Express modules offer ultimate durability and varying levels of performance-per-watt. They are well-suited for OEMs designing computing platforms into equipment for industrial or harsh environments, and when reducing the overall design cycle and lowering validation costs are of key importance. Onboard components are specifically selected for their reliability in demanding conditions. Unlike solutions designed for benign environments, our processor and memory are soldered to the board for maximum resistance to shock and vibration. Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes. |
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systerra
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Rugged COM Express Baukasten für MIL-Computer
Acromag hat speziell für den MIL-AERO-Markt eine ausgesprochen flexible Hardwareplattform entwickelt. Diese bietet moderne, gebrauchsfertige Technologie für breitgefächerte Projektanforderungen ... more
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Abaco
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mini COM Express Module Based on NVIDIA® Tegra® K1 GPU processing technology
Abaco’s mCOM10-K1 COM Express module is the miniature form-factor solution in our COM Express portfolio, and offers the high level performance and ultimate durability needed for applications that operate in harsh environments... more
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Acromag
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Rugged COM Express Modules with Intel Core i7 or i5 Processor
The XCOM-6400 is a rugged Intel® Core™ i7/i5 CPU in Type 6 basic format with 4th Gen i7/i5 (Haswell) processor and to 16GB removable memory more
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Eurotech
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NEW - Rugged Xeon D-15xx COM Express Compact Type 6
The CPU-161-18 combines a high performance and truly embedded CPU with an innovative hybrid RAM architecture that offers the ruggedness of soldered memory and the expandability of SO-DIMMs. The standard configuration provides 8GB of memory soldered directly on the PCB and supports up to 24GB DDR4 RAM with ECC error correction through a SO-DIMM slot, targeting use cases where extreme ruggedness is required, and those that need a large memory... more
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GE Automation
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Rugged Intel Core 2 Duo COM Express Module (-40...+85°C)
GE's bCOM2-L1100 is a rugged, Type 2 COM Express module in basic form factor. It features a soldered Intel® Core™ 2 Duo processor with varying levels of performance-per-watt improvements to meet low-power, high performance embedded applications requirements ... more
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GE Automation
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Rugged VIA Nano or VIA Eden Type 6 COM Express Module
GE´s bCOM6-L1200 is a rugged, Type 6 COM Express module based on VIA Nano™ or VIA Eden™, designed for harsh environments, offering ultimate durability and varying levels of performance-per-watt ... more
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GE Automation
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Rugged 3rd Gen. Intel Core i7® COM Express Module
GE’s bCOM6-L1400 offers the high-level performance and ultimate durability needed for applications that operate in harsh environments. The bCOM6-L1400 should be selected for applications with multiple graphic functions or high-end computing needs... more
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GE Automation
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Rugged COM Express® Module Type 6 based on AMD R-Series APU “Bald Eagle”
GE’s bCOM6-L1700 module addresses the needs of many high performance applications, taking advantage of the significantly enhanced video processing, turbo-boost acceleration and power management capabilities of AMD processors... more
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GE Automation
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NEW - Rugged COM Express® Module Type 6
GE’s bCOM6-L1800 module addresses the needs of many high performance applications, taking advantage of the capable video processing, turbo-boost acceleration and power management capabilities of Intel® core™ processors... more
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GE Automation
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NEW - Rugged mini COM Express Module based on AMD´s G-Series SOC
GE´s mCOM10-L1500 takes advantage of the flexibility in cost, performance and power capabilities of the latest generation AMD Embedded G-Series System-on-Chip (SOC)... more
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RadiSys
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Rugged Intel Core i5/i7 Type 2/3 COM Express Module (-40...+85°C)
RadiSys's Procelerant® CEGM57XT combines the next generation performance Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset with RadiSys up to -40...+85°C extended temperature and vibration specifications ... more
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Standard COM Express Modules with X86 Processor
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Acromag
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Rugged COM Express Modules with Intel Core i7 or i5 Processor
The XCOM-6400 is a rugged Intel® Core™ i7/i5 CPU in Type 6 basic format with 4th Gen i7/i5 (Haswell) processor and to 16GB removable memory more
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Eurotech
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Intel Core i7 620 Series COM Express Module
Adbc8031 is a COM Express CPU module equipped with Intel® Core™ i7 620 series processor. It has a Basic Module size form factor with Type2 pin layout. With Mobile Intel® QM57 Express chipset, high performance processing
function and high-end graphics function are compactly realized in 2 chips ... more
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GE Automation
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Rugged Intel Core 2 Duo COM Express Module (-40...+85°C)
GE's bCOM2-L1100 is a rugged, Type 2 COM Express module in basic form factor. It features a soldered Intel® Core™ 2 Duo processor with varying levels of performance-per-watt improvements to meet low-power, high performance embedded applications requirements ... more
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GE Automation
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Rugged VIA Nano or VIA Eden Type 6 COM Express Module
GE´s bCOM6-L1200 is a rugged, Type 6 COM Express module based on VIA Nano™ or VIA Eden™, designed for harsh environments, offering ultimate durability and varying levels of performance-per-watt ... more
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GE Automation
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Rugged 3rd Gen. Intel Core i7® COM Express Module
GE’s bCOM6-L1400 offers the high-level performance and ultimate durability needed for applications that operate in harsh environments. The bCOM6-L1400 should be selected for applications with multiple graphic functions or high-end computing needs... more
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GE Automation
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NEW - Rugged mini COM Express Module based on AMD´s G-Series SOC
GE´s mCOM10-L1500 takes advantage of the flexibility in cost, performance and power capabilities of the latest generation AMD Embedded G-Series System-on-Chip (SOC)... more
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RadiSys
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Core 2 Duo 945GM COM Express Module
The CE945 offers Core 2 Duo processing power combined with dual channel memory on a basic (95 x 125mm) size module brings unprecedented processing power to the mighty but small CE945GM computer-on-module ... more
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RadiSys
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Core™ 2 Duo Processor COM Express Module
The Procelerant™CEGM45 combines the next generation performance Intel® Core 2 Duo processors and the GM45 chipset with RadiSys designed dual channel memory to provide breakthrough processing performance on a basic size COM Express module ... more
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RadiSys
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Intel i5 / i7 COM Express Module with DDR3 RAM, and Q57 Chipset
The Procelerant® CEGM57 combines the next generation performance Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset with RadiSys design expertise to provide breakthrough processing performance on a basic size Type 2 COM Express module ... more
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RadiSys
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Rugged Intel Core i5/i7 Type 2/3 COM Express Module with ECC Support
RadiSys' Procelerant® CEQM57-ECC combines the next generation performance Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset with error-correcting code (ECC) memory ... more
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COM Express Carrier Boards
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Acromag
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COM Express module type 2/3 Carrier Card with Mini PCIe site
Acromag’s ACEX4405 carrier card supports both Type 2 and Type 3 COM Express modules at a small footprint of only 95mm x 125mm. Designed for harsh environments, the ACEX4405 has an extra rigid PCB and extended temperature support... more
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Acromag
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COM Express Type 6 Rugged Carrier Cards with XMC, PMC, and Mini PCIe Slots
Acromag’s ACEX-4600 Type 6 COM Express carrier cards employ a number of key features that are critical for successful use in the rugged environments of defense/industrial applications... more
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Acromag
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COM Express Type 6 Development Systems
The ACEX-4600-EDK is an engineering development kit to be used with the ACEX-4620/ACEX-4610 Type 6 COM Express Carrier boards. It provides access to all Type 6 COM Express peripherals via industry-standard connectors ... more
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Advantech
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SOM-Express Development Board
Advantech SOM-Express (COM Express kompatibel) Trägerboard für Prototypen / Entwicklung ... more
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GE Automation
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NEW - Type 6, COM Express® evaluation carrier in Mini-ITX form factor
GE’s MX05 delivers the high levels of erformance and durability needed for critical infrastructure applications that operate in small and portable applications. It is ideal for low power consumption, small form factor applications found in medical and industrial automation settings... more
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RadiSys
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ATX Size COM Express Carrier Board for Type 2 Modules
The RadiSys Procelerant® ATX carrier boards are development platforms that enable customers to initiate proprietary, customer-specific designs with RadiSys COM Express modules easily and quickly ... more
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Rugged COM Express System Lösungen
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| Acromag |
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White Paper |
How to Build a Rugged COM Express System
Simplyfing the Design of a Custom Type 6 COM Express System ... |
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Acromag
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Rugged Compact i7 COM Express PC with one XMC/PMC Site
Acromag’s ARCX embedded computer is a customizable-off-the-shelf (COTS), SWaP-optimized deployable solution. This rugged, small form factor mission computer is designed for extreme rugged and MIL-AERO applications. This true COTS solution uses the Acromag COM Express Type 6 product platform... more
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Know-How & Dokumentation
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| Whitepaper |
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COM Express for MIL |
COM Express enables powerful small Form Factor Designs for Defence Applications
In today’s mil/aero industry, there has been a shift from customized, proprietary solutions to leveraging COTS building blocks in the deployment of mobile, mission-critical and high-performance applications ... |
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Whitepaper
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An Evolution in the COM Express Specification
This paper explains how this new COM Express 2.0 specification builds on the success of the COM Express 1.0 specification and brings exciting enhancements such as support for up to three Digital Interfaces, capable of supporting High Definition Multimedia Interface (HDMI), DisplayPort and SDVO ... more
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| Whitepaper |
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Rugged COM Express |
COM Express for Harsh Environments (GFT-788)
This white paper describes how design innovation of COM technology can expand its reach beyond low-stress environments and into more rugged conditions. GE Intelligent Platforms bCOM2-L1100 rugged COM Express module provides extensive protection to ensure reliable operation in applications that are subject to shock, vibration and extremes of temperature of -40...+85°C ... |
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systerra
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Rugged COM Express Baukasten für MIL-Computer
Acromag hat speziell für den MIL-AERO-Markt eine ausgesprochen flexible Hardwareplattform entwickelt. Diese bietet moderne, gebrauchsfertige Technologie für breitgefächerte Projektanforderungen ... more
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| Acromag |
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White Paper |
How to Build a Rugged COM Express System
Simplyfing the Design of a Custom Type 6 COM Express System ... |
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